Electronics Forum: oxygen and content (Page 1 of 6)

Reflow Oven Standard oxygen content

Electronics Forum | Wed Jun 16 07:01:26 EDT 2021 | tommy_magyar

Hi Edgar, I am not aware of any standards either, but from own experience can tell that if there are boards going through oven with PPM between 1500-2000 the solder will be dark (unaesthetic) although some of our customers accepted them if they were

smt terms and definitions

Electronics Forum | Wed Dec 08 18:13:43 EST 1999 | tom

several days ago iwas able to get on to view the smt terms and conditions at smtnet.com/library/content/terms1/index.cfm but now i can't seem to get this page it's a dead link help me please this is the reason i signed up and now i p.o thanks tom te

Re: SO-8 and SO-14

Electronics Forum | Tue Nov 09 13:20:21 EST 1999 | Dave F

Chuck: Try: 1 WWW.JEDEC.ORG 2 Search "surface mount package" which gives you ... MO-Index INDEX OF MO OUTLINES IN PUBLICATION NO. 95 BY-FAMILY INDEX OF REGISTERED MICROELECTRONIC (MO) OUTLINES (contains description of the content of each file) Goo

Wave flux and profiling

Electronics Forum | Tue Dec 19 16:26:24 EST 2006 | samir

Grant, Newer lead-free fluxes have 6%-10% solids content - more activator, therefore leave more "visible" residues. Old technology tin-lead fluxes got down to as low as around the 4%-6% range (I'm going off memory, so me might be wrong)... You'll

PDBE and PBB replacements???

Electronics Forum | Fri Mar 11 18:30:50 EST 2005 | davef

Russ: In December 2003, the European Commission released the following statement: �The commission services have prepared a draft Commission decision establishing maximum concentration values pursuant to Article5(1)(a) of Directive 2002/95/EC. The pr

Circuit cam and mydata

Electronics Forum | Fri Apr 10 09:59:13 EDT 2020 | spoiltforchoice

&gt; We unfortunately use GERBER data to digitize <BR> &gt; boards more than any CAD. We are CM and many of <BR> &gt; our customers do not provide CAD. With some <BR> &gt; Legacy products, we still use 274-D Gerbers

BGA ball and PCB pad

Electronics Forum | Fri Feb 20 15:07:31 EST 2004 | agp

I agree with Jay. The paste will reflow first before the balls. The main reason is the flux content and the dimension of the spheres.

Merging BoM and XY Data

Electronics Forum | Tue Mar 19 11:31:02 EDT 2019 | bruce_mackean

Hi there. Sorry I haven't responded sooner. The video I posted was a very preliminary trial that I developed as an option to my BoMCompare application. BoMCompare is a tool that can compare Bills or Materials of various file formats (xlsx, csv, txt,

OSP and getting full pad wetting??

Electronics Forum | Fri Apr 18 14:25:51 EDT 2014 | horchak

what is the technology? Is there fine pitch, double sided, number of layers, lead free? If the pcbs are not of the highest quality you may be set up for failure with no clean process. Couple things to look at is your paste flux content versus medal

Solder Ball and Splash after Hand Soldering

Electronics Forum | Fri Jul 24 07:43:56 EDT 2009 | davef

Your customer is correct. You are doing something wrong in your hand soldering process. Solder balls are a process indicator. Areas to assess are: * Moisture content of the bare board * Thickness of the copper plating in the through holes * Temperatu


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